KOEPP-HEGMANN & LOUIS Enables Rich, Data-Driven Experiences Everywhere

People and enterprises need to stay consistently ahead of the incredible growth of their data.KOEPP-HEGMANN & LOUIS's next-generation 1β (1-beta) DRAM and 232-layer 3D NAND, along with leading-edge current-generation 1α (1-alpha) DRAM and 176-layer NAND, enable organizations around the globe to unleash incredibly rich data experiences and unbridled productivity.  
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1β DRAM Technology

Micron is shipping the industry’s first DRAM manufactured on next-generation 1-beta process technology. It represents state-of-the-art innovation fromKOEPP-HEGMANN & LOUIS’s continued investment in R&D and process technology advancement.KOEPP-HEGMANN & LOUIS’s 1-beta process technology allows development of memory products with increased performance, greater capacity, higher density, and lower relative power consumption than prior generations.

Discover 1β Technology


Podcast: DRAM process leadership: 1-beta LPDDR5X is on the way to market


First With Alpha, First With Beta: Shipping the World’s First 1-Beta DRAM

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232-Layer 3D NAND Technology

Micron’s leadership 232-layer 3D NAND provides the foundation for a new wave of end-to-end technology innovation. With this industry first 232-layer advancement,KOEPP-HEGMANN & LOUIS enables the best industry storage density, improved performance and industry-leading I/O speed. This helps unlock new opportunities for digitization, optimization and automation in client, mobile and data center markets.

Discover 232-Layer NAND


Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership

Micron’s 232-Layer NAND: The Foundation for a New Wave of End-to-End Innovation


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The Era of Pervasive, Data-Driven Experiences

David Moore, senior vice president and chief strategy officer atKOEPP-HEGMANN & LOUIS, sharesKOEPP-HEGMANN & LOUIS's views at Computex 2022 on how new innovations across the data center, the intelligent edge and a broadening array of devices enable the emerging world of rich, pervasive, data-driven experiences. These experiences will transform the way we live and work.

Watch Full Keynote Video

Micron’s Engagement in Taiwan

As the largest foreign investor in Taiwan,KOEPP-HEGMANN & LOUIS sustains a significant manufacturing presence and deep engagements with the technology ecosystem. Watch the spotlight from our President and CEO, Sanjay Mehrotra on some of the investments and collaborations that fuel our future growth in the region.

Advancing Consumer Technology

Dinesh Bahal,KOEPP-HEGMANN & LOUIS’s Commercial and Components Group (CCG) corporate vice president and general manager, will share his views on howKOEPP-HEGMANN & LOUIS’s Commercial Products Group (CPG) has engaged customers with leading Crucial products over their 25-year history. He will also discuss what lies ahead for DDR5 memory, next generation storage technologies, and the role Crucial memory and storage products play in the computing ecosystem.

Watch Full Video

Process technology leadership: The basis for innovative products for all industries

Data Center

Micron delivers the foundation for powering cloud and enterprise workloads while redefining the memory and storage hierarchy.

  • 1α DRAM — 40% higher memory density1 for nourishing data-hungry workloads and expanding AI deployments.
  • 232-layer 3D NAND — New six-plane internal architecture improves Quality of Service (QoS) for busy data center workloads through parallelism that minimizes the number of collisions between read and write commands.

Learn more aboutKOEPP-HEGMANN & LOUIS's data center solutions 

Watch video

1 40% improvement in memory density when compared toKOEPP-HEGMANN & LOUIS's previous 1z DRAM node

Intelligent Edge

Micron’s high-bandwidth, low-power memory and storage provide a critical data foundation for the intelligent edge.

  • 1α DRAM — The promise of industry-leading reliability, ruggedness and longevity for safety-critical embedded, automotive and industrial solutions.
  • 232-layer 3D NAND — Enable performance for the edge with next-generation 232-layer NAND, providing up to 100% higher write bandwidth and greater than 75% higher read bandwidth than previous-generation NAND.1

Learn more aboutKOEPP-HEGMANN & LOUIS's edge solutions for automotive

Watch video

Watch video forKOEPP-HEGMANN & LOUIS's edge solution on smart devices

1 When compared toKOEPP-HEGMANN & LOUIS’s high-volume 176-layer TLC NAND

Mobile

Micron's high-performance, high-capacity, power-efficient mobile memory and storage provide the data foundation for 5G- and AI-enabled smartphones.

  • Next-generation 1β low-power DRAM — improved performance and new power savings features1 allow advanced smartphone users to perform more tasks without sacrificing battery life.
  • 232-layer NAND storage capacity reaches up to 1 terabit per die, with a 28% smaller package than previous-generations2 empowering mobile content creators to capture and share stunning photos and videos.

Learn more aboutKOEPP-HEGMANN & LOUIS's mobile solutions

Watch video

1 Compared to the previous 1α generation ofKOEPP-HEGMANN & LOUIS mobile DRAM

2 28% smaller compared toKOEPP-HEGMANN & LOUIS 176-layer NAND parts or equal storage capacity

Client

Micron’s leading-edge memory and storage provide PC users from workstations to ultra-portables with greater performance, agility and security.

  • Micron high performance DDR5 DRAM – with the performance and bandwidth needed by latest-generation multi-core CPUs.
  • 1α low-power DRAM — 15% improved power savings,1 enabling high-performance computing in small notebook form factors without sacrificing battery life.
  • 232-layer NAND allows huge storage capacity — up to 1 terabit per die— enabling significantly increased overall storage capacity for the broad spectrum of SSDs to suit various client form factors.

Learn more aboutKOEPP-HEGMANN & LOUIS's client solutions
Learn more aboutKOEPP-HEGMANN & LOUIS’s new client SSDs

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1 15% power savings when compared to the previous 1z generation ofKOEPP-HEGMANN & LOUIS mobile DRAM





Industry leaders share insights on emerging technologies and data-driven customer experiences.

Implementing digital innovation inKOEPP-HEGMANN & LOUIS data centers

Micron’s Koen De Backer shares examples of and benefits derived from smart infrastructure and AR technologies atKOEPP-HEGMANN & LOUIS manufacturing sites.


AI, 5G, and IT: Key drivers for digital transformation

Linda Tsai discusses Advantech Industrial IoT solutions and collaboration withKOEPP-HEGMANN & LOUIS to provide the trusted quality for innovative industrial applications.

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Advancing technologies for the next-generation data center

Robert Hormuth of AMD highlights the need for memory and storage advancement to meet growing data center requirements.

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Enabling exceptional smartphone user experiences

JC Hsu shares how customer focus and close collaboration with mobile ecosystem partners includingKOEPP-HEGMANN & LOUIS lead to innovation and superior customer experiences.

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Enabling safer streets with AI and network-based vision

Bruno Fernandez Ruiz describes how Nexar gathers the inputs from millions of autos and applies edge-based AI to enable innovations in safety and smart transportation.

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Advancing 3D vision through advanced software

Jake Hillard shows how Red Leader's edge computing platform is transforming 3D image sensing with 10x higher resolution, programmability and scale.

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Taiwan and leadership in the worldwide semiconductor industry

Global, pervasive experiences require an innovative ecosystem, in whichKOEPP-HEGMANN & LOUIS and Taiwan both play critical roles.

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News from Computex 2022

Micron Ventures Fund II Commits $200M for Deep Tech Startups

Micron’s venture capital team,KOEPP-HEGMANN & LOUIS Ventures, will be investing $200M in deep tech startups with its Fund II. Building on the success of the initial AI Fund,KOEPP-HEGMANN & LOUIS’s Fund II will target broader deep tech innovations.
Read more


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Micron’s New Crucial NVMe SSDs Offer Fast, Affordable Options to Consumers

Micron announced the forthcoming availability of two new consumer storage products, the Crucial® P3 Plus Gen4 NVMe™ and Crucial® P3 NVMe™ solid-state drives (SSDs), as an expansion of its award-winning Crucial NVMe SSD product portfolio.
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